Whit Vinson is a R&D Associate on Power Electronics Packaging with Oak Ridge National Laboratory’s Vehicle Power Electronics Research Group. He is also a University of Tennessee-Oak Ridge Innovation Institute Fellow, working with the institute’s Fusion Technology and Materials for Extreme Environments Convergent Research Initiative. 

Vinson works in the field of developing materials and strategies for operating electronics in harsh environments. His current research project is in advancing packaging to expand electronic operating ranges. 

While at the University of Arkansas, Vinson was a graduate research assistant at the Engineered Multi-Physical Interactions & Reliability Evaluations Laboratory. He was a John Deere Performance Reliability Engineering intern and a Sandia National Laboratories Technial Staff intern. All of which gave him research experience working with packaging, reliability evaluations, and thermomechanical analysis and design for micro- and power electronics as well as data analysis for system-level performance evaluations.

Education